Corporate profile

Corporate History

Date Matter
December, 1989 Techno Alpha Co., Ltd. established in Minato-ku, Tokyo.
January, 1990 We contracted distributorship agreement with Orthodyne Electronics Corporation for wedge wire bonder.
November, 1995 Our headquarter office moved to Gotanda, Tokyo.
August, 1997 We contracted distributorship agreement with Deweyl Tool Company, Inc for bonding tool.
December, 1998 We had business transfer from Inchcape Machinery for Life boat and Davit.
October, 2000 We contracted distributorship agreement with Advanced Integrated Technologies, Inc. for an electrode.
December, 2001 We created rooms for demonstration and training in our headquarter office.
May, 2002 We established Technical Service Center in Nagoya, Japan.
October, 2003 We contracted distributorship agreement with New Logic Research, Inc. for Vibrated Membrane Filter.
September, 2004 Enter into sale of our original brand of Flip-chip Die-bonder.
January, 2005 We contracted distributorship agreement with Diener Electronic GmbH for Plasma Cleaner equipment.
October, 2007 We Techno Alpha Co., Ltd. went public on the Osaka Stock Exchange “Hercules”,currently "JASDAQ".
May, 2009 We Techno alpha Co., Ltd. subsidy Comtech corporation.
January, 2010 We contracted distributorship agreement with Kulicke&Soffa (Japan), Ltd. for Ball-Bonder equipment.
May, 2010 Enter into sale of Vacuum Reflow Soldering equipment from PINK GmbH Thermosysteme.
January, 2011 We contracted distributorship agreement with DR. TRESKY AG for Manual Die-Bonder and Manual Flip-chip Bonder.
March, 2011 We contracted distributorship agreement with Plan Optik AG for glass substrates.
September, 2011 We Techno Alpha Co., Ltd. acquired 100% ownership of Peritec Corporation.
December, 2011 We Techno Alpha Co., Ltd. mergerd Comtech Corporation.
January, 2014 We Techno Alpha Co., Ltd. acquired 100% ownership of KYA technologies corporation.

Corporate profile