Information

2015

Dec.16.2015
Dec.16-18 Exhibited at the SEMICON JAPAN 2015
Aug.20.2015
Handling start the Measurement Device for Wedge/Ball Bond
Aug.20.2015
Sep.16-18 Exhibited at the JAPAN TEST 2015
Mar.17.2015
Jun.3-6 Exhibited at the JPCA Show 2015
Jan.16.2015
Jan.14-16 Exhibited at the INTERNEPCON JAPAN
Jan.10.2015
Jan.14-16 Exhibited at the IC PACKAGING TECHNOLOGY EXPO

Information