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Wedge Wire Bonder |
Orthodyne Electronics
(USA) |
Orthodyne Electronics manufactures wire bonders that ultrasonically weld round aluminum
wires ranging from 25 to 500 microns (1 - 20 mils) in diameter. Bonders
with Orthodyne's PowerRibbon process, ultrasonically weld aluminum ribbons
from 500x100 to 2000x300 microns (20x4 - 80x12 mils) in cross-section.
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| Ball Bonder |
Kulicke ＆ Soffa
(USA) |
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The Power Series is Gold and Copper wire bonding equipment.This equipment is setting new standards for performance,
productivity, upgradeability and ease of use.
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Vacuum Reflow Soldering |
PINK Gmbh
(Germany) |
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PINK offers innovative soldering technologies for voidfree connections
of power semiconductors, hybrid- and multichip-assemblies as well as electronic
packages.
- VADU 100 and 300 - Also you can get our vacuum inline soldering systems
in other sizes and designs.
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Bond Tester |
XYZTEC
(Netherlands) |
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The Condor EZ offers a single platform with multiple test capabilities allowing end-users the added
flexibility of performing many types of tests all in one system. In addition to standard bond testing
applications such as wire pull, ball shear and die shear,the Condor EZ has the capability to perform peel
testing, push testing and roller testing.
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● Surface Mount Technology (SMT) |
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Die-Bonder |
Techno Alpha
(Japan) |
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Techno Alpha provides its original products Die-Bonder ＆ Flip-chip Bonder
which are available as custom-made.
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Plasma Cleaner |
Diener Eletronic
(Germany) |
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The two different plasma effects are available: low pressure plasma and
atmospheric plasma.
Plasma can be used in many different cases whenever you would like to modify
surfaces. Therefore Diener Electronic produces plasma systems in different
types according to the size, process and control.
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Temperature Monitoring System |
Datapaq
(UK) |
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Datapaq supplies temperature profiling systems in five major areas: Oven Tracker for the finishing industry,
Reflow Tracker for electronics, Furnace Tracker for heat treaters, Kiln Tracker for ceramics and Food Tracker for food processors.
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Vapor Phase Reflow System |
R＆D Technical Services
(USA) |
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The system uses an inert liquid that when heated, creates a very stable uniform
heat transfer medium in the form of vapor. This heat transfer medium replaces
heat energy very quickly. It transfers heat to the product by condensing
this heated vapor to the product with little regard to mass.
From table top batch type units, to production size batch type units,
to high volume inline units, to custom designs, R&D does it all.
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Wafer Bonder for MEMS |
Applied Microengineering Ltd
(UK) |
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Our AWB Platform allows alignment and bonding in one machine for a variety of wafer sizes from 2" - 8".
AML offers the best bonding package in terms of cost,performance ＆ the flexibility to satisfy most MEMS applications.
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● Materials and Consumables |
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Bonding Tools |
DEWEYL
(USA) |
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DeWeyl Tool provides the finest quality bonding wedges in the world. The wedges we produce are made from
ceramic, titanium, and tungsten carbide, and are used in bonding aluminum, gold, copper, and platinum wires.
The Ceramic tip wedge offers impressive benefits and it has a proven track record on both production and R＆D products.
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Adhesives |
Cookson Electronics
(USA) |
Cookson Electronics offers a full line of thermoplastic and thermosetting
polymer bonding products. "STAYSTIK" products cover a complete range of mechanical, electrical and thermal properties and are used for temporary mounting
or permanent bonding.
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| Moisture Getter |
Cookson Electronics
(USA) |
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Cookson Electronics offers a full line of quality products that improve working life and reduces field failures. "HiCap", "STAYDRY",
GA and H2 products are formulated to scavenge moisture, particles and hydrogen. Products cover a range of mechanical properties and application techniques.
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Thick Film Paste |
KOARTAN
(USA) |
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KOARTAN Microelectronic Interconnect Materials is a supplier of thick film pastes for a wide range of electronic applications.
The product line includes silver based and gold based conductors, dielectrics and glazes, resistors and thermistors, capacitor
materials, substrate plug pastes, etchable conductors and specialty products.
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Cleaning Solvent |
ZESTRON
(Germany) |
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Novel, innovative aqueous, semi-aqueous as well as solvent-based cleaning
agents for printed circuit board defluxing processes are able to effectively
remove all types of flux residues, ranging from RMA and OA to newly developed
synthetic materials.
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Electrode |
Advanced Integrated Technologies
(USA) |
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Advanced Integrated Technologies ( AIT ) is the industry leading manufacturer of resistance welding electrodes for all makes of welders
including Palomar/Hughes, Unitek, Avio, MacGregor, and Sunstone Engineering. AIT’s efficient manufacturing processes allow you to build
very affordable electrodes. AIT builds both parallel gap and straight through welding electrodes, in all RWMA materials. AIT’s standard product line of
resistance welding electrodes covers a broad spectrum representing many applications.
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Pre-form Solder |
Pfarr
(Germany) |
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The eutectic composition Bi(58)Sn(42) is insertable for soldering temperature-sensitive electronic components. Due to its low melting
point it is possible to operate at low soldering temperatures. Possible fields of application are special requirements in semiconductor assembly
and high frequency technology or as fusible safety devices. PFARR offers this soldering composition for high quality applications in customized
dimensions with close tolerances.
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Cu Bonding Wire |
Henan Youk ElectronicMaterials
(CHINA) |
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Now, Cu(Copper) bonding wire is accepted alternative to Au(Gold) bonding wire and widely used in semiconductor devices.
In addition, Cu bonding wire is used in semiconductor devices as a connection material between the chip and the outside of the main circuit, due to its excellent mechanical
and electrical properties (101% IACS) as well as its second bonding-spot stability.
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Vibrated Membrane Filter |
New Logic Research
(USA) |
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Eight reasons why "VSEP" outperforms conventional separation systems are High Filtration Rates ,Fouling Resistance ,High Solids ,High Efficiency,
Engineered Dependability ,Compact Design ,Convenient Testing and Low Cost.
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Ceramic Membrane |
TAMI Industries
(France) |
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TAMI Industries designs and manufactures industrial ceramic filters (membranes) for the separation of molecules of liquids in fine ultrafiltration,
ultrafiltration and microfiltration. Ceramic membranes advantages are Resistant to high temperatures,
Resistant to acids and bases,Resistant to solvents,Resistant to high pressure,Long working life and Environmentally friendly.
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Life Boat |
NISHI-F
(Japan) |
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Techno Alpha sells Nishi-F Life Boats to Japan Coast Guard and many japannese major shipbuilding companies.
These Life Boats are IMO compliant and have many benefits such as good habitability, easy attachability with Lifting Machine and good ship maneuverability.
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Boat Davit |
Techno Alpha
(Japan) |
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Techno Alpha markets Boat Davits which are lifting machines for life boats and patrol boats.
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Solar Cell Analytical Instrument |
Techno Alpha
(Japan) |
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This analytical system can measure I-V characteristics of solar cells for
R&D. Customization is available according to customers' needs.
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